Optic Communication

1. High speed single-mode device die bonding ◆ DML Single chip eutectic bonding ◆ EML Multi chip eutectic，Rapidly Dies placement by multi bond heads with multiple chips ◆ Multi channel COC to Box epoxy process bonding ◆ Multi channel Lens passive b...

Lidar

1. EEL COB Epoxy bonding ◆ Multi dies and different angle bonding ◆ <±3-5um ◆ <±0.2° 2. VCSEL Array mounting ◆ Multi chip bonding ◆ <±3um ◆ <±0.1°-0.2° 3. Pump laser and seed source packing ◆ Seed source Box/To packaging ◆ Pump source eutectic applic...

Commercial Laser

1. CoS/Bar eutectic ◆ Parallel process with multiple bond heads ◆ High reliability eutectic quality ◆ High precision <±3um ◆ High efficiency 8S/Die(Excluding temperature curve) 2. Single COS to Box Eutectic ◆ Automatic process replaces vacuum reflow ...

5G (PA device)

◆ High reliability scrubbing eutectic process ◆ Support for multi dies eutectic bonding ◆ Supporting various processes such as gold tin, gold silicon, and nano silver etc. Click to view related products >> MV-15D High-accuracy Die Bonder (Multi funct...

AR/VR

◆ High intelligence visual recognition: The visual algorithm adopts neural networks and deep learning technology to accurately identify and locate ◆ High precision flatness control technology: supports any shape of glasses, supports global automatic ...

MEMS

◆ High precision force control, minimum 10g ± 1g ◆ Support for multi chip stacking ◆ High precision epoxy quality control Click to view related products >> MV-15D High-accuracy Die Bonder (Multi function, Flexible) >> MV-15T High-accuracy Die Bonder ...

High power IGBT

◆ Application of sintering bonding (such as nano silver film transfer printing) ◆ The standard force of 30kg, optional of 50kg and 100kg Click to view related products >> MV-50S Sintering Bonde

Microwave, RF

Click to view related products >> MV-15D High-accuracy Die Bonder (Multi function, Flexible) >> MV-15T High-accuracy Die Bonder (High Speed, Epoxy process) >> MV-15H-S High-accuracy Die Bonder (Supports single chip eutectic) >> MV-15H-M High-accuracy...

Advanced Sensor

Click to view related products >> MV-15D High-accuracy Die Bonder (Multi function, Flexible) >> MV-15T High-accuracy Die Bonder (High Speed, Epoxy process) >> MV-15H-S High-accuracy Die Bonder (Supports single chip eutectic) >> MV-15H-M High-accuracy...