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English
22years
标题

Technology accumulation

60%
标题

Ratio of R&D personnel

10+
标题

Global regional layout

12000㎡
标题

Production base area

ABOUT US

A Company of Excellent Services

22+ Years Experienced

Founded in 2019, Microview is a national-level specialized and sophisticated "Little Giant" enterprise focused on the R&D and manufacturing of high-precision, complex-process chip packaging equipment, dedicated to providing advanced packaging equipment and systematic solutions to global semiconductor and pan-semiconductor customers.

 

Microview boasts a globally leading product portfolio covering high-precision die bonders, eutectic bonders, 3D ultra-thin stacking die bonders, flip chip bonders, TCB bonders, aligners, and die sorters...

OUR PRODUCTS

Explore Our Recent Products

3D Thin Stack Die Bonder Mbonder-M3000-Mbonder-M3000

3D Thin Stack Die Bonder Mbonder-M3000

Mbonder-M3000

2024-07-12

3D Thin Stack Die Bonder

Mbonder-HF High-accuracy Die Bonder-Mbonder-HF

Mbonder-HF High-accuracy Die Bonder

Mbonder-HF

2024-07-12

• High Accuracy: Glass die ±1.5um • Multi-Function：Supports for different process including Eutectic, Stamping, Dispensing, UV curing etc. • Multi-chips application: Supports for up to 100 different types of suction nozzles with fully automatic repla...

Mbonder-HEM Multi-Chip Eutectic Gang Bonder-

Mbonder-HEM Multi-Chip Eutectic Gang Bonder

2024-07-12

1.5um Multi-Chip Eutectic Gang Bonder

Mbonder-HGP High-accuracy Die Bonder-Mbonder-HGP

Mbonder-HGP High-accuracy Die Bonder

Mbonder-HGP

2024-07-12

• High Accuracy: Glass die ±1.5um • High Quality Epoxy Process: Specific for COB/Gold Box epoxy application, Supports for Stamping, expensing, UV curing during the bonding process. • High production efficiency: unique 3-head design for Parallel opera...

Mbonder-AVR Optical Module Bonder-

Mbonder-AVR Optical Module Bonder

2024-07-12

• High intelligence visual recognition: Not rely on specific shape of the glass, supports global automatic scanning and high-precision positioning of different glass with vision marks; • High precision flatness control technology: <±5um flatness of t...

Mbonder-HFF Flip Chip Bonder-

Mbonder-HFF Flip Chip Bonder

2024-07-12

Mbonder-HEP High-accuracy Die Bonder-

Mbonder-HEP High-accuracy Die Bonder

2024-07-12

1.5um Inline Eutectic Bonder

Mbonder-LFT Bonder-

Mbonder-LFT Bonder

2024-07-12

SERVICES

Why Choose Us
High accuracy placement

±1.5um

High accuracy temperature control

50℃/S ,±3℃

High accuracy force control

±10%,10±1g

Flexibility software&process system

Multi_chip, Muti_tip, multi_process...

FACTORY VIDEO

Satisfaction is Our Motto

Microview focuses on the research, development, and manufacturing of die attach equipment. Its high-precision die bonders have even entered the global market as one of the leading Chinese brands.

APPLICATION

Technology Application Fields
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Optic Communication

2024-07-12

1. High speed single-mode device die bonding ◆ DML Single chip eutectic bonding ◆ EML Multi chip eutectic，Rapidly Dies placement by multi bond heads with multiple chips ◆ Multi channel COC to Box epoxy process bonding ◆ Multi channel Lens passive b...

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Lidar

2024-07-12

1. EEL COB Epoxy bonding ◆ Multi dies and different angle bonding ◆ <±3-5um ◆ <±0.2° 2. VCSEL Array mounting ◆ Multi chip bonding ◆ <±3um ◆ <±0.1°-0.2° 3. Pump laser and seed source packing ◆ Seed source Box/To packaging ◆ Pump source eutectic applic...

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Commercial Laser

2024-07-12

1. CoS/Bar eutectic ◆ Parallel process with multiple bond heads ◆ High reliability eutectic quality ◆ High precision <±3um ◆ High efficiency 8S/Die(Excluding temperature curve) 2. Single COS to Box Eutectic ◆ Automatic process replaces vacuum reflow ...

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5G (PA device)

2024-07-12

◆ High reliability scrubbing eutectic process ◆ Support for multi dies eutectic bonding ◆ Supporting various processes such as gold tin, gold silicon, and nano silver etc. Click to view related products >> Mbonder-HF >> Mbonder-HEM >> Mbonder-HGP ...

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AR/VR

2024-07-12

◆ High intelligence visual recognition: The visual algorithm adopts neural networks and deep learning technology to accurately identify and locate ◆ High precision flatness control technology: supports any shape of glasses, supports global automatic ...

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MEMS

2024-07-12

◆ High precision force control, minimum 10g ± 1g ◆ Support for multi chip stacking ◆ High precision epoxy quality control Click to view related products >> Mbonder-M3000

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High power IGBT

2024-07-12

◆ Application of sintering bonding (such as nano silver film transfer printing) ◆ The standard force of 30kg, optional of 50kg and 100kg Click to view related products >> Mbonder-HF >> Mbonder-HEM >> Mbonder-HGP >> Mbonder-AVR >> Mbonder-HEP >>...

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Microwave, RF

2024-07-12

Click to view related products >> MV-15D High-accuracy Die Bonder (Multi function, Flexible) >> MV-15T High-accuracy Die Bonder (High Speed, Epoxy process) >> MV-15H-S High-accuracy Die Bonder (Supports single chip eutectic) >> MV-15H-M High-accuracy...

9.advaced sensor（传感器）.JPG

Advanced Sensor

2024-07-12

Click to view related products >> Mbonder-M3000

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