Microview Manufacturing Center Phase 4 Begins Operation 12,000㎡ Production Base, Annual Capacity of 2,000 Die Bonders!-
Microview Manufacturing Center Phase 4 Begins Operation 12,000㎡ Production Base, Annual Capacity of 2,000 Die Bonders!
2026-06-01
Microview has officially put into operation its new 12,000 ㎡ Phase 4 manufacturing Center, elevating its high-end semiconductor packaging equipment capabilities. The facility enables a monthly output of 150 die bonders (2,000 units/year) a nd numero...