MV-15D High-accuracy Die Bonder (Multi function, Flexible)-

MV-15D High-accuracy Die Bonder (Multi function, Flexible)

• High Accuracy: Glass die ±1.5um • Multi-Function：Supports for different process including Eutectic, Stamping, Dispensing, UV curing etc. • Multi-chips application: Supports for up to 100 different types of suction nozzles with fully automatic repla...

MV-15H-S High-accuracy Die Bonder(Supports single chip eutectic)-

MV-15H-S High-accuracy Die Bonder(Supports single chip eutectic)

High Accuracy: Glass die ±1.5um • High reliable Eutectic Process: Specific for COC/COS eutectic application, Validated by industry benchmark customers in China, Proved high Eutectic quality for long term mass production. • High production efficiency:...

MV-15H-M High-accuracy Die Bonder (Supports simultaneous eutectic of multiple chips)-

MV-15H-M High-accuracy Die Bonder (Supports simultaneous eutectic of multiple chips)

High Accuracy: Glass die ±1.5um • High reliable Eutectic Process: Specific for COC/COS eutectic application, Validated by industry benchmark customers in China, Proved high Eutectic quality for long term mass production. • High production efficiency:...

MV-15T High-accuracy Die Bonder (High Speed, Epoxy process)-

MV-15T High-accuracy Die Bonder (High Speed, Epoxy process)

• High Accuracy: Glass die ±1.5um • High Quality Epoxy Process: Specific for COB/Gold Box epoxy application, Supports for Stamping, expensing, UV curing during the bonding process. • High production efficiency: unique 3-head design for Parallel opera...

MV-50A High-accuracy Die Bonder-

MV-50A High-accuracy Die Bonder

MV-MAR Micro Assembly Bonder-

MV-MAR Micro Assembly Bonder

MV-AVR Optical Module Bonder-

MV-AVR Optical Module Bonder

• High intelligence visual recognition: Not rely on specific shape of the glass, supports global automatic scanning and high-precision positioning of different glass with vision marks; • High precision flatness control technology: <±5um flatness of t...

MV-50S Sintering Bonder-

MV-50S Sintering Bonder

• Special equipment for nano silver film transfer printing； • High bonding force with standard pressure is 30kg, optional for 50kg or more. • Widely used in packaging fields such as High power SiC module.