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ABOUT US

A Company of Excellent Services

20+ Years Experienced

The Microview Intelligent Packaging Technology (Shenzhen) Co., Ltd，founded in 2019,specializing in the R & D and production of high-precision chip packaging equipment.

Microview has a complete set of independent core technologies,the core members have more than 20 years of experience in high-precision chip packaging industry.

Microview Intelligent is dedicated to building a world-class, high-end chip packaging equipment enterprise and is committed to establishing partnerships with enterprises around the world.

20years
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Technology accumulation

60%
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Ratio of R&D personnel

10+
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Global regional layout

4000㎡
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Production base area

OUR PRODUCTS

Explore Our Recent Products

MV-15D High-accuracy Die Bonder (Multi function, Flexible)-

MV-15D High-accuracy Die Bonder (Multi function, Flexible)

2024-07-12

• High Accuracy: Glass die ±1.5um • Multi-Function：Supports for different process including Eutectic, Stamping, Dispensing, UV curing etc. • Multi-chips application: Supports for up to 100 different types of suction nozzles with fully automatic repla...

MV-15H-S High-accuracy Die Bonder(Supports single chip eutectic)-

MV-15H-S High-accuracy Die Bonder(Supports single chip eutectic)

2024-07-12

High Accuracy: Glass die ±1.5um • High reliable Eutectic Process: Specific for COC/COS eutectic application, Validated by industry benchmark customers in China, Proved high Eutectic quality for long term mass production. • High production efficiency:...

MV-15H-M High-accuracy Die Bonder (Supports simultaneous eutectic of multiple chips)-

MV-15H-M High-accuracy Die Bonder (Supports simultaneous eutectic of multiple chips)

2024-07-12

High Accuracy: Glass die ±1.5um • High reliable Eutectic Process: Specific for COC/COS eutectic application, Validated by industry benchmark customers in China, Proved high Eutectic quality for long term mass production. • High production efficiency:...

MV-15T High-accuracy Die Bonder (High Speed, Epoxy process)-

MV-15T High-accuracy Die Bonder (High Speed, Epoxy process)

2024-07-12

• High Accuracy: Glass die ±1.5um • High Quality Epoxy Process: Specific for COB/Gold Box epoxy application, Supports for Stamping, expensing, UV curing during the bonding process. • High production efficiency: unique 3-head design for Parallel opera...

MV-50A High-accuracy Die Bonder-

MV-50A High-accuracy Die Bonder

2024-07-12

MV-MAR Micro Assembly Bonder-

MV-MAR Micro Assembly Bonder

2024-07-12

MV-AVR Optical Module Bonder-

MV-AVR Optical Module Bonder

2024-07-12

• High intelligence visual recognition: Not rely on specific shape of the glass, supports global automatic scanning and high-precision positioning of different glass with vision marks; • High precision flatness control technology: <±5um flatness of t...

MV-50S Sintering Bonder-

MV-50S Sintering Bonder

2024-07-12

• Special equipment for nano silver film transfer printing； • High bonding force with standard pressure is 30kg, optional for 50kg or more. • Widely used in packaging fields such as High power SiC module.

SERVICES

Why Choose Us
High accuracy placement

±1.5um

High accuracy temperature control

50℃/S ,±3℃

High accuracy force control

±10%,10±1g

Flexibility software&process system

Multi_chip, Muti_tip, multi_process...

FACTORY VIDEO

Satisfaction is Our Motto

Favor the more eloquent presidential days of yester year give ipsum a whirl and get some engaging.

APPLICATION

Technology Application Fields
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Optic Communication

2024-07-12

1. High speed single-mode device die bonding ◆ DML Single chip eutectic bonding ◆ EML Multi chip eutectic，Rapidly Dies placement by multi bond heads with multiple chips ◆ Multi channel COC to Box epoxy process bonding ◆ Multi channel Lens passive b...

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Lidar

2024-07-12

1. EEL COB Epoxy bonding ◆ Multi dies and different angle bonding ◆ <±3-5um ◆ <±0.2° 2. VCSEL Array mounting ◆ Multi chip bonding ◆ <±3um ◆ <±0.1°-0.2° 3. Pump laser and seed source packing ◆ Seed source Box/To packaging ◆ Pump source eutectic applic...

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Commercial Laser

2024-07-12

1. CoS/Bar eutectic ◆ Parallel process with multiple bond heads ◆ High reliability eutectic quality ◆ High precision <±3um ◆ High efficiency 8S/Die(Excluding temperature curve) 2. Single COS to Box Eutectic ◆ Automatic process replaces vacuum reflow ...

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5G (PA device)

2024-07-12

◆ High reliability scrubbing eutectic process ◆ Support for multi dies eutectic bonding ◆ Supporting various processes such as gold tin, gold silicon, and nano silver etc. Click to view related products >> MV-15D High-accuracy Die Bonder (Multi funct...

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AR/VR

2024-07-12

◆ High intelligence visual recognition: The visual algorithm adopts neural networks and deep learning technology to accurately identify and locate ◆ High precision flatness control technology: supports any shape of glasses, supports global automatic ...

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MEMS

2024-07-12

◆ High precision force control, minimum 10g ± 1g ◆ Support for multi chip stacking ◆ High precision epoxy quality control Click to view related products >> MV-15D High-accuracy Die Bonder (Multi function, Flexible) >> MV-15T High-accuracy Die Bonder ...

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High power IGBT

2024-07-12

◆ Application of sintering bonding (such as nano silver film transfer printing) ◆ The standard force of 30kg, optional of 50kg and 100kg Click to view related products >> MV-50S Sintering Bonde

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Microwave, RF

2024-07-12

Click to view related products >> MV-15D High-accuracy Die Bonder (Multi function, Flexible) >> MV-15T High-accuracy Die Bonder (High Speed, Epoxy process) >> MV-15H-S High-accuracy Die Bonder (Supports single chip eutectic) >> MV-15H-M High-accuracy...

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Advanced Sensor

2024-07-12

Click to view related products >> MV-15D High-accuracy Die Bonder (Multi function, Flexible) >> MV-15T High-accuracy Die Bonder (High Speed, Epoxy process) >> MV-15H-S High-accuracy Die Bonder (Supports single chip eutectic) >> MV-15H-M High-accuracy...

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